this post was submitted on 20 Nov 2023
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Intel

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[–] [email protected] 1 points 11 months ago (2 children)

when MTL has a 128MB cache on SOC die.

It doesn't tho

And the renders for the on package memory have the two memory chips separate from the die with no safe area on the package border, when Intel would traditionally try to have them right next to each other.

Idk, it looks very similar to this

And why use N3 when Intel will have Backside power with their 3nm node?

Bcuz they are lame lol.

Intel talked about using TSMC N3 nodes in their products before. It won't be too surprising to see it in client CPU tiles as well.

[–] [email protected] 1 points 11 months ago

nice comment fuss with digital warrior btw!
It was quite frustrating yet fun to see a regular user trying to defend his ill-informed contrarian position against someone who clearly has industry info.
btw I know that 90% of what he said are correct. 90% because the rest is kinda up to interpretation.