0gopog0

Yeah.

I've helped people assemble computers many times since it was released, and it's only really in really tight spaces where'd I'd recommend others if a non-stock cooler is being consider (outside of visual design requests). Availability is a factor of course, but I haven't come across a situation where at least one of the PA120 (SE or not) coolers wasn't available pretty easily online.

And?

Is someone holding a gun to an OEM's head forcing them to integrate it? Are there truly no products for which their highest TDP processors are not feasible or the correct choice to use? Are OEM's clueless for recognizing the portion of the market who are willing to purchase machines with those chips?

The answer to all those questions is no, and I would really rather the market offer options if someone has use for them than discard them because most don't. Heck, there's a non-zero portion of the market that would love it if Apple had a M2 Ultra Macbook as an optiopn

Intel just shamelessly pushing desktop CPUs into laptops with 200 watt power consumption nowadays lol

Being really blunt here, Intel is not the one putting 200 watt power CPU's inside of laptops. There's lot to criticism Intel for, but OEM design choices are not one of them.

Large die surface area helps a lot. In many ways heat density is a bigger challenge than total heat generated.

under normal conditions.

Under normal conditions there isn't much importance, as cooling to room temperature isn't really a problem. Under abormal conditions you have a few more options for thermal management. Assuming this process has no vibrations or detracting factors, and doesn't consume more energy for heating, I can think of situations where this may be useful. Neither application is really consumer facing, and more under the commerical side of things.

First one, would be scientific equipment that is temperature sensitive for measuring vibration in a range of extreme enviroments.

Second one - and one I think is much more compelling - would be satellites. Temperature management, and just maintaining component health, is a pretty big deal when it comes to continued operation when you can have a potential 200C temperature differential from the outside of the lit surface to the dark side of the other. Being able to retain heat better as opposed to having to engage electric heating elements during periods of low power use/thermal generation from onboard systems, would be a great change.