this post was submitted on 15 Dec 2023
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Wasn't AMD already using chiplets for their CPUs?
For years. 2017 if you argue the separate CCXs in Zen1 Threadripper to be chiplets.
2019 with Zen2 if you're not counting that.
AMD is pretty ahead of everyone when it comes to packaging tech.
Next thing they'll declare to be the first to use 3D packaging in their CPUs.
Amd's chiplets are different from Intel's.
AMD's chipltets are discrete "modules" that are physically separate from each other.
Intel is trying to make an almost monolithic die, but using distinct chips sitting directly next to each other with (I believe) an almost direct link.
AMD's chiplet design isn't very good for low power low load uses (like laptops) while Intel's approach should be much better for laptops. Sapphire rapids is closer to AMD's chiplet design, but dear god do those CPUs use a lot of power.
Honestly I see little difference, the parts of the cpu are divided differently and Intel's are closer and designed to have more modularity overall, but still declaring it to be the first made using chiplets is basically not true.
I'm not bieng an AMD fanboy here, I just don't like when company boast/hyping goes too far.
Who's saying it's the first attempt at chiplets? It's not even Intel's first attempt, that would be sapphire rapids more recently, or those old awful pentium extreme dual "cores" that were almost literally two CPUs glued together.
In the article, the bit I quoted in my top post.