this post was submitted on 20 Nov 2023
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SK Hynix and Nvidia reportedly working on a radical GPU redesign that 3D-stacks HBM memory directly on top of the processing cores (www.tomshardware.com)
submitted 11 months ago by [email protected] to c/[email protected]
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[–] [email protected] 1 points 11 months ago

These are all in flip-chip packages. So no, power would come up through the bottom, and the transistors would be closest to the top.