this post was submitted on 20 Nov 2023
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SK Hynix and Nvidia reportedly working on a radical GPU redesign that 3D-stacks HBM memory directly on top of the processing cores (www.tomshardware.com)
submitted 10 months ago by [email protected] to c/[email protected]
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[–] [email protected] 1 points 10 months ago

Heat. The processor generates most of the heat, so you want the back side of the die somewhere a heat spreader can more or less directly connect to.