this post was submitted on 01 Nov 2023
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AMD is working to reduce heat generated by high-density CPU chiplets (www.techspot.com)
submitted 10 months ago by [email protected] to c/[email protected]
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[–] [email protected] 1 points 10 months ago

The fully integrated backplate breaks compatibility with half the AM4 coolers anyways. They should have taken the full plunge and made the IHS thin enough so that the CPU wouldn't throttle under load.