this post was submitted on 01 Nov 2023
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No actual mentions of how? Micro channels for liquid cooling like planned before? Other methods? Anyone ever try a vaper chamber direct die solution? Too hard to get it flat, or are construction costs too high, or is it just not effective?
A vapor chamber over such a small area would have little benefit. They're great at spreading heat around, but when your IHS is already that small it's not much better than solid copper. On something the size of EPYC or Threadripper is may make more sense, but they've done quite a good job of spreading the heat out by arranging the CCDs, to the point where no part of the IHS is likely saturated.
I'd love to be able to test out one of those big-boy chips, but sadly the price tag is equally large.
They’ve already tried vapor chamber according to GN’s tour of the AMD lab. They decided what they had was good enough
What about dead silicon? Should be an easy band aid to at least distribute some of the heat from the CCX to a larger surface before the heatspreader comes into play, no?