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Most important bit for those as eager to get their preorder as I am:

This means that if the final qualification process doesn’t uncover any issues, we’ll send the first “We’re preparing your batch” emails to Batch 1 customers in late January.


In our first four updates, we shared progress as we identified and closed engineering issues and manufactured our production qualification units of Framework Laptop 16. We’ve now shipped a large number of press units, for which reviews will start to appear later this month. Note that the issues we’re calling out below are ones that are present on press review units that are fixed on customer units. This means rather than cherry picking perfect units for press, we’ve ended up with some minor areas where you’ll see improvements beyond what reviewers have.

We’re happy to share that there are no new unresolved issues in this update. The main item gating the mass production schedule remains the CPU heatsink, which we have an update on below. Rather than doing a quick patch to get manufacturing yield above the threshold, Cooler Master spent the last two weeks overhauling their manufacturing process, building new test fixturing, and outputting validation samples. This means we have a complete solution to the original issue, but one which took a bit more time. We have the first production quantities of the final heatsink arriving at our laptop factory the week of January 22nd, and our goal is to output the first set of Batch 1 customer systems from the factory before the end of January, after which they will go to our warehouse to prepare for shipments.

This means that if the final qualification process doesn’t uncover any issues, we’ll send the first “We’re preparing your batch” emails to Batch 1 customers in late January.

New issues

No new unresolved issues!

In progress

  1. Yield issues on CPU thermal system - We’ve split this into two line items to go deeper into each. First, on the CPU heatsink, Cooler Master was able to adjust their vapor chamber soldering process to resolve the yield issue, and actually improved the thermal performance overall as a result. They also developed a new production test fixture to screen each manufactured module more thoroughly to ensure it meets the quality spec before shipping out. To vet all of this, Cooler Master is now preparing a small batch of heatsinks using the final mass production manufacturing and test process. These will be completed on 1/12, and to accelerate the system-level test schedule, will be hand carried from Cooler Master’s factory outside Shanghai to our laptop factory in Taoyuan. At that point, we’ll build them into a small number of production qualification laptops to ensure they also pass our system level manufacturing tests. To further pull in the schedule, rather than waiting for the results of the system tests, we’re “risk buying” enough heatsinks to cover Batch 1 and part of Batch 2. This means that Cooler Master is going directly into mass production, with us accepting and taking liability for the risk that we find an issue with the material during the system-level tests. This might sound frightening, but it’s a relatively common scenario in manufacturing, and appropriately balancing risks is a core responsibility of our Supply Chain Team!
  2. Liquid metal installation - In parallel to the CPU heatsink qualification, we’re qualifying the final recipe for liquid metal thermal pad and containment barrier installation. We’ve iterated on several configurations and put them through some extreme torture tests. For example, we ran Prime95 on units sitting in six orientations on a vibration table for three hours, we put systems through high-G shock while running Prime95, and we are running an extended period of thermal cycling. All of this is to build confidence that the final configuration is robust to handling and aging. All of this is set to intercept the heatsink schedule.

Resolved issues

  1. Tuning capacitor noise - We found and resolved one additional scenario that could result in a high pitch noise coming from the Mainboard when using >20V power adapters.
  2. Touchpad row sliding friction - We found and resolved a material quality issue that could result in excess friction in sliding the Touchpad Module and Touchpad Spacers on and off.
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Framework 這種模組化的筆電還滿有趣的,可以裝 Linux,最重要的是可以運來台灣。而且,有 fedi 帳號喔!
@[email protected] @[email protected]

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On Windows 10, I often have a problem where the laptop will charge and then stop charging and then charge again with one second intervals. I've updated the firmware to the latest version and the issue persists. I'm not sure if this is caused by the charger, internal hardware, or is a Windows bug.

Anyone else experience this?

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i know they cooperate with amd a lot so it's possible right?

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Tried a few options, really wanted a soft case. Can't speak highly enough for the think tank case, it fits just right and can accommodate the ethernet module too.

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On their order page, it says "Ships within two weeks"

Cheers!

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My goal is a blobless Linux Framework laptop, but AFAIK there are no open source drivers for the included AMD RZ616 WiFi card. What would you do, replace that it a different M.2 card? Do any blobless ones exist? Any recommendations?

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This is likely our last Framework Laptop 16 Deep Dive before we start shipping, and those of you who ordered one can dive deep on your own. We began mass production of Mainboards last week, which we’ll hold onto as we resolve the last few remaining open items to begin full system manufacturing.

You may be thinking, do we really need a deep dive on connectors? The answer is a resounding “Yes!”, as connectors are surprisingly among the most complex and critical parts of building a product that is slim, durable, high performance, and easy to repair. Connectors are the electrical and mechanical interfaces between modules in the system. They are what actually makes the product modular! Each connector needs to be easy to engage, hard to accidentally disengage during vibration or drop, robust across repeated reconnections, thin enough to fit within a tiny space, electrically sound from a signal integrity and power perspective, readily manufacturable, and cheap. Our most complicated connectors are made up of dozens of tiny formed metal parts in plastic or metal shells. Given the complexity, our preference is always to find well-proven off-the-shelf connectors. However, occasionally we run into unique interconnect scenarios that don’t match anything out there. In these instances, we’re forced to customize our own solutions. With Framework Laptop 16, we developed two of these to enable our new module ecosystems. Input Module Connector

The first is the connector that interfaces to Input Modules and the Touchpad Module. This is what enables the hot-swappable modules that allow full input deck customization on Framework Laptop 16. From a signal perspective, this one is relatively straightforward. There are only eight pins, supporting up to one amp at 5V and with no signals faster than USB 2.0. However, from a mechanical standpoint, this was exceptionally challenging. The pins are exposed when Input Modules are removed, meaning they have to be extremely robust to handling. In addition, because of how our Touchpad Module engages, the connectors have to be able to handle not just compression force but also many cycles of shear force. All of this has to work within very limited thickness too. We initially started with a spring-based connector (on the left) during our EVT build but found it to be easy to accidentally bend and break the pins. We then quickly pivoted to a pogo pin solution (on the right), working with CFE, one of the world's largest pogo manufacturers to build a custom solution. Despite being just 0.8mm in diameter, the brass pins are incredibly durable. They are rated to 10,000 cycles and are difficult to damage even if you try to.

The second connector is vastly more electrically complex. This is the interposer that connects the Mainboard to Expansion Bay Modules. This is what enables upgradeability of high-performance modules like discrete GPUs with Graphics Modules in Framework Laptop 16. This has two 74-pin interfaces supporting 8-lane PCIe 4.0 (and potentially higher), DisplayPort, and >10 amps at 20V. These are extremely difficult specifications to meet, and are made even more complex through our requirement to make it an easy connector to handle and cycle repeatedly. We started with the off-the-shelf FXBeam connector from Neoconix that was used in attempts from other brands at making a modular graphics system in a notebook. We quickly found that these connectors (on the left in the image) could only reliably be installed once. On removing, handling, and reinstalling, it was easy to bend or break off the small pins. We then worked closely with Neoconix to build our own customized version of FXBeam (on the right in the image) that is compatible with the same Mainboard interface, but is substantially more robust. The structure hooks the pins into place and prevents them from being malformed by force from any direction. With that, the interposer is safe for handling and repeated cycling, letting you swap between Expansion Bay Modules with ease.

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Reflecting on my Year with the Framework Laptop 13

@[email protected]

I've been loving this laptop. Hope you enjoy the review!

https://vale.rocks/posts/A-Year-With-The-Framework-Laptop-13

#blog #review #tech #FrameworkLaptop #FrameworkLaptop13

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My laptop is arriving on Monday and I haven't picked a distro yet. I currently use Debian but that is on older hardware. I'm experienced with a lot of distros so I'm a bit flexible here. I was thinking openSUSE for the sake of the latest and greatest AMD drivers, but I do see that Fedora is officially supported while openSUSE is not. Are there any hardware compatibility issues I could expect?

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In our first update email, we gave a quick overview of where we are on starting Framework Laptop 16 manufacturing and a list of open issues. There are still a handful of firmware items that are open and module production dates that are pending for full system production. However, we’ve made excellent progress in the last two weeks, and we’re happy to share that Mainboard mass production has started! This means the first set of final Mainboards are flowing down the manufacturing line this week at our factory in Taiwan. We’ll run them through the normal testing procedures and hold them while we prepare for full system manufacturing.

We’re eager to close out the rest of the opens, build the first units, and get them out to you all. We have a list of the remaining open items below, along with the issues from the last update that are now resolved.

New issues

  1. High pitched airflow noise in the Graphics Module fan - We identified an airflow path in the Graphics Module fan that could result in a high pitch noise. This is another issue that was resolved in DVT2, but we found a regression in it during pre-mass production sample checking. Our supplier was able to resolve the issue with an adjustment to one of the internal mechanical parts in the fan that guides the airflow path. We’re now determining whether there is any impact to the schedule from needing to adjust tooling and rework already produced fans, but we don’t expect this to be the long pole in the schedule.

In progress

  1. The fans have a small chirping noise on startup - Our fan supplier was able to root cause the issue and revise the fan to remove the chirping noise. The initial production schedule for updated fans is currently the longest pole for our system production schedule, so we’re working closely with the supplier to find ways to shorten it.
  2. Power tuning during heavy loading - Our graphics card provider was able to revise the card and is proceeding into production on it. Even though the issue is resolved, we’re tracking it as “in progress” since Graphics Module manufacturing is one of the longer pole items on our production schedule. We’re also continuing to tune firmware to maximize performance across different power scenarios (on full battery, on low battery, on a 100W adapter, on a 180W adapter, on a 240W adapter, etc)
  3. Graphics Module compatibility issues in Linux - We’re still working closely with the team at AMD to debug Linux compatibility issues on the Graphics Module. Our current assumption is that VBIOS firmware needs to be modified. Linux compatibility is extremely important, and we’re committed to making sure it is smooth before launch.
  4. USB-PD firmware is in the process of completion - With the Framework Laptop 16 being the first product on the market supporting 180W and 240W USB-C along with a complex scheme for handling Expansion Cards, our USB-PD firmware is complicated. Implementation is nearly complete, and we also want to ensure we do sufficient testing before our target 12/8 mass production internal firmware release.
  5. LED Matrix module schedule is trending late - We’re working with the supplier to pull in their schedule to meet launch timing, but it is still trending late.

Resolved issues

  1. Cosmetic issues on aluminum forming parts using high recycled material content - We’ve completed process tuning and set cosmetic criteria that gives good results without resulting in excessive yield loss for production. In parallel, we’re working with the aluminum parts supplier on an improved source for post-consumer recycled material to use in the long run.
  2. Our Numpad vendor used out of spec resistors - Our supplier was able to build new interface boards with the correct resistors, and their overall module production is on schedule.
  3. Tuning capacitor noise - Our supplier was able to switch some capacitors to low noise variants and adjust the slew rate on some power rails, which substantially reduced noise.
  4. Expansion Bay Interposer manufacturing yields - The interposer manufacturer was able to tune the tooling and assembly process on the custom connector, and yields are at the level required for production. The timing of production quantities is currently on track to meet our system production. We’re really excited about this connector, and will be sharing more detail in an upcoming blog post on how it enables GPU modularity.
  5. Late display firmware update - We were able to roll out a new EDID into panel production that enables DCI-P3 correctly, and panel deliveries are on track for system production.
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Couldn't be any happier. Now to put it through its paces over the coming days.

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cross-posted from: https://infosec.pub/post/5442742

Hello! I am doing some if-I-die planning, and I want to create a machine that is separate from my current homelab that can a) host paperless-ngx and b) be used with keyboard/mouse/monitor if needed. I want it to replace my current paperless-ngx instance that's hosted in my lab.

Ideally, I'd want two SSDs in RAID 1, possibly with a third drive for the OS? I'll be backing up to my NAS and from there to the cloud, but I want to separate this machine from the rest of my infrastructure and still be able to have reliable access to the documents on it.

In theory, I could just sync the files to a USB drive and tell her to grab it if anything should happen to me, but finding the right files while stressed without the metadata stored in paperless wouldn't be the nicest thing to make her do.

tl;dr: What should I buy to build a homelab-in-a-box that can be attached to my homelab normally but also function separately as a PC.

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Time to buy your RAM and storage guys

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Is there any progress regarding buying a Framework without Intel Boot Guard or AMD PSB enabled?

There is a dead discussion on the framework community form where framework talked about

exploring the idea of shipping a version of the mainboard with boot guard disabled for those who want to run their own firmware

back in 2021 but nothing since.

https://community.frame.work/t/intel-boot-guard-coreboot/1178

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